circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 23, 2020

Brian Czaplick, Director: Marketing & Sales, Air-Vac Engineering Co

Electrical engineers have complex jobs that only get tougher over time. Not only do they have to design on accelerated timelines with shoestring budgets, but increasingly they are asked to put parts too small to see into enclosures too small to fit them. This is the driver behind flex and rigid-flex PCBs, and it's what we’ve built each and every day for the past 20 years.

We've seen our business increase by 50-75% over the past year. To support our customers' needs, we built a brand new factory for flex and rigid-flex printed circuit boards – one of the only new manufacturing facilities opened in the industry this year.

We will continue to add technical capability and purchase new equipment to get quality boards in our customer’s hands faster than they knew was possible, and in many cases that means delivery in hours instead of days.

Our primary focus is the Military, Aerospace, and Healthcare markets, and with our increased capabilities in our new facility, we will undoubtedly expand and pick up new partners in growing markets such as Automated Test Equipment and Wearable Products.

2019 was a wonderful year for Royal Flex Circuits. 2020 will be even better.
Brian Czaplick
Director: Marketing & Sales,, Air-Vac Engineering Co
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling