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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 24, 2020

Bert Horner, Engineering Support, The Test Connection Inc (TTCI)

Air-Vac Engineering's Rework Division is a bellwether for the North American Electronics Industry. Our business volume in the fourth quarter of 2019 exploded to extremely high levels so I am very optimistic for 2020. We will launch a major new product in 2020 that will change the way that underfilled components will be reworked in the future.

Fourth quarter business volume in our Automation Division was also extremely high despite the China tariff dispute that impacted several of our major customers. Other growth markets for our Automation products include Semiconductor, Optoelectronics, Medical, Automotive and Military. Every multi-function Automated Assembly Cell is custom designed to meet specific customer requirements so new product development is a constant for us in this business.

Air-Vac invented the first air-operated vacuum pump in 1959. Today, our Vacuum Pump Division continues its focus on innovative, specialty vacuum pumps for major OEM's.

Overall, I expect 2020 to be a strong business environment for all of our products.

Bert Horner
Engineering Support, The Test Connection Inc (TTCI)

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura