circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 28, 2020

Kunal Shah, PhD., President, LiloTree

Since ECD's products are designed and manufactured in the USA, the trade dispute impact has been negligible. In fact, the global supply chain has shown remarkable strength in its adaptability which has, for the most part, lessened the tariff effect on our customers. While uncertainty isn’t ideal for the market in general, forecasts remain optimistic for 2020.

Though ECD is credited with inventing in-transit thermal profiling technology, we haven’t rested on our laurels or waited for competitive patents to expire. Our continuous innovation philosophy has ensured ongoing advancement and new product introduction across process areas – not just in thermal profiling.

M.O.L.E.® thermal profilers remain the market leader and, in its first year, SmartDRY™ Intelligent Dry Storage set a new benchmark for J-STD performance with fast recovery rates that enable MSD compliance while raising productivity.

In 2020, ECD will officially launch OvenSENTINEL™ and its TrueProfile™ technology at the IPC APEX EXPO event. After recognizing shortcomings in commercially available reflow oven monitoring products, ECD has developed a revolutionary process monitoring system that aligns with Industry 4.0 standards, open interfaces and delivers real-time, actionable data for corrective adjustments.

Outside of the ambiguity with tariffs and politics, consumer confidence is high, the electronics industry is healthy and we believe 2020 will deliver respectable manufacturing growth.
Kunal Shah, PhD.
President, LiloTree
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling