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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 4, 2020

David Raby, President & CEO, STI Electronics, Inc.

2019 was certainly an exciting year for our company as well as the industry in general. The manufacturing expansion and growth in domestic markets experienced in 2018 continued in 2019.

Our on-going quarterly technical workshops focusing on implementation of low volume surface mount assembly processes at our Pennsylvania-based manufacturing location continue to be well attended.

As one of the only true USA-based manufacturers of low volume surface mount assembly systems, our domestic customers continue to realize the benefits of on-shoring and partnering with us.

As we look forward to 2020, customer collaboration led us to new product developments in selective soldering systems and we are excited to introduce this system at APEX 2020.

All signs point toward a buoyant 2020.
David Raby
President & CEO, STI Electronics, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling