circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 5, 2020

Mihir Shah, CEO, InspectAR

As an international producer of high-performance inspection systems for the manufacture of electronic components, Viscom understands how the demands placed on complex intelligent products increase. Quality standards become ever more stringent. Cost pressures on manufacturers are met by maximizing efficiency whilst processes are controlled and simultaneously optimized in real time.

Software interfaces for machine-to-machine communication as well as the fully-fledged smart factory are subjects that we will further pursue in this connection. Initiatives such as IPC CFX and Hermes Standard are examples of this.

Our customers' requirements are many and varied. We are experiencing an increasing demand for X-ray technologies and combined 3D-AXI/3D-AOI solutions. Market trends such as electromobility and renewable energies demand sophisticated concepts for inspecting batteries and power electronics.

Viscom's product portfolio reflects this demand. We are also systematically employing 3D technologies in other areas of inspection. The most recent example is the inspection of circuit board undersides (THT/Pressfit).

As always, Viscom is synonymous with high-end inspection solutions equipped with ultra-modern software and tailored to suit the market's needs. In 2020, we are looking forward to stable, worldwide business performance with existing customers while recognizing the potential for growth in new markets and further innovation.
Mihir Shah
CEO, InspectAR
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling