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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 6, 2020

Gary Goldberg, President & CEO, PROMATION, Inc.

2019 has been a tough year for all SMT companies globally. The SMT society has become one international integrated village, and no one can be immune from the economic slowdown. In the meantime, the industry is speeding up to adapt the industry 4.0 to put smart to the manufacturing process.

While the production lines are becoming fully automatic, and the smart storage towers are being put in the factories, the counting the components left in the reels remains manual. The manual way of counting components is both time consuming and operator demanding. Not to mention the accuracy is very low.

Since the introduction the X-ray component counting technology three years ago, Scienscope has captured the attention of International companies. Companies such as flex, Sanmina, Bosch, Foxconn, have tried the technology carefully at the beginning, and realized it as the answer to their puzzle.

For year 2020, I predict that more and more companies will adopt this technology to help them streamline the production process, and inch closer to the true industry 4.0, which requires minimum human intervention.

X-ray component counting will become a future standard solution as an important part of the inventory management, because it is fast, and accurate. Most importantly, the return on investment is unprecedented.
Gary Goldberg
President & CEO, PROMATION, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling