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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2020

Michael Dube, Vice President of Manufacturing and Engineering, Rochester Electronics, LLC

Sunstone had a very good year in 2019, bringing on several very strong new customers, equipment and technology upgrades, improvements to our manufacturing and quality systems, and making it faster and easier for the Design Engineer, Purchaser or entrepreneur to get high quality PCBs made in the US, when they need them.

Every day we continue to make strides towards a nearly effortless experience, similar to Amazon; you make a couple clicks and your PCBs arrive at your door. We now Move towards 2020 optimistic that the strong economy and the continuation of the electronics renaissance will continue to bring more and more opportunities our way, coupled with significant changes to products and our design software platforms propelling us in the right direction for sustained growth.

I am very grateful for all of the amazing people that I get the pleasure of meeting and working with on a daily basis. I hear personal stories of triumph and perseverance from the employees of Sunstone Circuits who bring life to our business. In addition, Sunstone has many customers, each with a very interesting story that as a collective tells a grander story of innovation and triumph and Sunstone is proud to be a part of it.

Thanks once again to all of you that have trusted Sunstone to deliver what you need over these many years and to our employees that continually do whatever it takes to keep adapting to fast moving changes. A toast to many more years of continued success.
Michael Dube
Vice President of Manufacturing and Engineering, Rochester Electronics, LLC
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling