Robert Boguski, President, Datest

Rochester Electronics offers a full range of semiconductor manufacturing services including design, assembly, plating, die/wafer banking, reliability testing, and analytical services providing single solutions through full turnkey manufacturing. This enables our customers to achieve faster time-to-market along with providing a continuous source of supply over the entire semiconductor product lifecycle.

We now offer a range of Open Cavity Packages (OCPs) for a variety of package styles including Quad Flat No-Leads (QFNs) with quick turnaround time for prototype semiconductor solutions across a broad range of applications. Rochester's new prototype area in our Newburyport, MA clean room facilities area includes the capability to perform wafer back-grind, polishing and dicing, die attach, wire bonding and encapsulation allowing our customers the ability to characterize, test, and probe their devices within the QFN package to validate new device performance.

In addition, Rochester Electronics has experience in custom assembly for RF and Microwave products - a recent example included GaAs MMIC chip attach into LCC (Leadless Chip Carrier) packages using conductive epoxy. Rochester's engineers successfully implemented wire bond techniques with minimal wire lengths to yield repeatable performance up to 30GHz.

For 2020 we see strong demand in sectors such as 5G telecom, Automotive, Military/Aerospace and Industrial Automation.