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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 14, 2020

Milan Shah, Founder and CEO, Royal Circuit Solutions

KIC was ahead of the times with the introduction of automatic profiling more than 40 years ago. A key to KIC's success has been the ability to provide solutions to its customers for all their thermal needs. Now with the transition to increased automation and connectivity in the world of Industry 4.0, customers are utilizing this real-time and historic usable and actionable thermal data allowing manufactures to include their reflow product data into their factory improvement plan.

Information is critical to improving processes, saving money and manufacturing consistently high-quality products. Obtaining this information live and being able to analyze and act on it immediately is the key. This has been, and continues to be, KIC's forte. We are fortunate to work with many partners for software integration with MES systems, IPC's CFX, Hermes and more.

We continue to invest in R&D to bring innovative products to the market that offer our customers solutions for the challenging assemblies that our industry is seeing. We expect further industry growth in 2020 at home and in developing markets. KIC anticipates that in 2020 we will see many more companies take steps towards factory automation and we're excited to have the solutions for making their thermal processes smart and efficient.
Milan Shah
Founder and CEO, Royal Circuit Solutions
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling