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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 6, 2021

Chintan Sutaria, Founder & President, CalcuQuote

While the COVID -19 virus has caused short-term volatility, we see stability in the long-term. The ITW business model has put us in a strong position to ride out the pandemic and win the recovery. We have navigated the pandemic with limited disruption in production and product innovation. Customer orders and shipments remain strong.

We have many of our administrative staff working from home, and on the production side we have multiple social distancing and hygiene processes in place. Participation in non-essential activities such as trade shows and travel are being deferred, however, we have pivoted to online training, customer support, and virtual demos.

The pandemic's economic toll has been uneven with automotive, industrial and mobile phone verticals hit hard. Communications infrastructure (5G), work-from-home electronics, medical, and semiconductor fared better. We expect continued headwinds from the pandemic and other conditions in 2021 but will drive the recovery by providing added value and new innovations.

We are working with several market leading customers on advancements that will help them realize the vision they have for higher yields, better performance and Industry 4.0 automation. The developments we are working on will bring differentiated value to all our customers well into the future.
Chintan Sutaria
Founder & President, CalcuQuote
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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