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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 7, 2021

Dan Beaulieu, President, D.B. Management Group L.L.C.

As with most companies the pandemic has affected our business. However, our R&D Department has been very busy.

We have new products in the field of 3D wire bond inspection, 3D SPI and advanced innovations for 3D AXI. For example: The delivery of battery inspection systems for testing round cells took place in the third quarter of 2020.

Several systems were delivered to the USA and integrated into a high speed production line. A prototype for in-line AXI 3D computed tomography of pouch cells, which are used in electric cars, smartphones and tablets, has also been completed.

For 2021 we plan more webinars and we will be launching a new website. Furthermore we will continue to strengthen the Viscom market position by introducing the brand-new iX7059 3D-AXI series for PCB, large PCB, heavy duty and battery inspection. The economic outlook is difficult to predict, but Viscom customers' and suppliers' production chains are ramping up, and customer enquiries are increasing.
Dan Beaulieu
President, D.B. Management Group L.L.C.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling