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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 13, 2021

Michael Dube, Vice President of Manufacturing and Engineering, Rochester Electronics, LLC

Despite the economic upheaval and change in business caused by the pandemic, there is the promise of light at the end of the tunnel. Altus is seeing signs of an upturn as the industry looks to invest in new technology and improved manufacturing in 2021 and we expect to see increased interest in equipment that will advance automated capabilities.

Covid-19 was a wakeup call in terms of ensuring manufacturing processes can continue even in uncertain times. Those heavily reliant on manual processes have realized that they must identify ways to improve manufacturing procedures and address conventional assembly processes to work in today's environment.

The drive for increased automation and the improvement of electronics assembly requires a 'Smart' SMT line and an even smarter THT line.

We are seeing more and more customers choosing to implement equipment which provides this technology and gives users the ability to accomplish tasks which would otherwise be impossible through manual methods, or when staff numbers are reduced. Automated processes also offer precision and consistency improvement, whilst increasing throughput through autonomous methods.

In times of volatility there is clearly an opportunity for companies that are willing and nimble enough to adapt and plan for the future. We are eager to see how our industry develops and strives to implement processes to support automation. What is for certain, is that companies making smart investments early will reap the largest rewards of increased profitability in the long term.
Michael Dube
Vice President of Manufacturing and Engineering, Rochester Electronics, LLC
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling