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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 26, 2021

Dave Sigillo, Vice President, Seica USA

Few will miss 2020. Humanity has suffered enough sickness, death, isolation, and disruption for a lifetime. My thoughts go out to all those who have lost a loved one, watched their children miss a year of in-person school, or become unemployed.

So, here's to 2021! While we all ache to get back to normal, we must remember that much of 2021 will look like 2020 and we all must remain vigilant to keep employees and their families safe. That's our #1 priority and we feel lucky to have had no cases of COVID to date.

We enter 2021 in a new headquarters building that was purpose built for us during the pandemic. Our new HQ provides the space we need to hold our growing team and meet the needs of our customers who are responding very favorably to our new parallel testing capabilities. As it turns out, manufacturers like to have options to test more boards in less time.

We are hopeful that 2021 will allow electronics manufacturers greater clarity about their markets and opportunities to invest in technologies that improve quality and streamline production processes.
Dave Sigillo
Vice President, Seica USA
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling