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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 29, 2021

Matthias Fehrenbach, CEO, Eutect GmbH

2020 was turbulent, but at the same time it opened up many opportunities for us. We have used the time to further align our internal processes towards our customers and to push ahead with our development plans.

Also, we positioned our new reflow generation "R-Series" on the market and received insanely positive feedback from our customers. We will introduce a new machine generation in the field of vacuum-reflow as well, based on our more than 10 years of experience in this area. For us and the entire industry, it will be an exciting year 2021!

Matthias Fehrenbach
CEO, Eutect GmbH

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura