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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2021

Tom Forsythe, Executive Vice President, KYZEN

I'm excited about the prospects of 2021 and seeing the door close on 2020. Like everyone else, STI was deeply affected by COVID-19 but not completely in a negative way. Our team adapted and there are things we are doing such as online training for our customers as well as more automated processes that will benefit us in the years ahead.

Our manufacturing continues to grow in capabilities and I look forward to adding more non-traditional (for us) customers into our high reliability contract manufacturing mix in 2021. Our Training department is offering some new products both in person and online. I look forward to business picking up as travel increases and satisfying some pent-up demand.

Speaking in general terms, I'm hoping for a more predictable year with the vaccines stabilizing or greatly slowing the virus and the putting the election cycle behind us or at least resetting. Both of those things should get us back to the good ole days of at least being able to plan more than a few days ahead.
Tom Forsythe
Executive Vice President, KYZEN
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling