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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 4, 2021

Victor Hemingway, President, Royal Flex Circuits

As we move into 2021, producing distortion-free high frequency signals - particularly as they apply to sensors and PCBs used in automotive electronics and telecommunications - is our preeminent focus. There's no doubt that HF capability, combined with extremely high reliability, is what will be required. This has been at the core of our planning for a decade, and a prime driver of our development work with advanced nickel-free systems, including EPIG, EPAG and IGEPIG / IGEPAG premium gold surface finishes.

I predict that nickel-free surface finishes like EPIG will have a breakout year in 2021. Uyemura's EPIG is our fastest growing product line, growing beyond forecasts in 2020, with the roster of part numbers specifying it increasing in tandem. The growth came from diagnostic medical devices, automotive, and telecom, where EPIG’s cleaner signal integrity and faster signal speeds deliver important advantages.

The medical devices industry requires surfaces with high purity and low porosity and benefits greatly when nickel is replaced with palladium. Regarding automotive interest, autonomous vehicles are now just 2 years away. Lightning-fast vehicle-to-vehicle communication for GPS and safety sensors will be critical for trucks, cars, taxis, buses and tractor-trailers, with operating frequencies above 50 GHz being the norm.

End user companies are positioning themselves to compete in the self-driving vehicle market, with early adopters testing Uyemura EPIG since 2017. Telecoms, satellite and cell phone manufacturers have been testing nickel-free final finishes for 2-5 years. Our expectation is that several PCB market segments will convert new-generation part numbers to nickel-free final finishes in 2021.
Victor Hemingway
President, Royal Flex Circuits
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling