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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 8, 2021

Michael Harlow, Co-Founder and Vice President, Kodiak Assembly Solutions

With the unprecedented impact of COVID-19 on both an economic and human level, 2020 was a year filled with many challenges. New year optimism quickly turned to uncertainty as COVID-19 took hold and affected all aspects of business. After a difficult first two quarters however, DDM Novastar experienced a sharp uptick in business activity during the 2nd half of the 2020.

As we move into 2021, DDM will continue with new product introductions in selective soldering and make additional improvements to existing products.

As a well-established, USA-based, technology-driven manufacturer of low volume surface mount assembly systems, DDM Novastar resiliently stands with our fellow domestic manufacturers as we continue to work closely with our customers to meet their board assembly needs and support their activities as a local source of SMT assembly equipment and soldering systems during the coming year.

We look forward to a better 2021 for all.
Michael Harlow
Co-Founder and Vice President, Kodiak Assembly Solutions
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling