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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 9, 2021

Roberto Yebra, Technology & Marketing Specialist, Test Research, Inc.

Advanced Assembly is an essential business. We remained open during the Covid-19 pandemic to provide low to mid-volume PCB assembly for critical civilian, government, and medical businesses. Like our customers, we experienced initial challenges from the Covid-19 outbreak in Q2, but our business rebounded by Q3.

The 2020 pandemic economic fallout reinforced our core business values of quality, speed, and outstanding customer experience top to bottom. We know that we must earn our customers’ business every day, and in 2020, Advanced Assembly received AS9100 certification, expanded our manufacturing facility to 35,000 square feet, and was named one of Colorado's top places to work.

Looking ahead to 2021 we will continue to invest in technology, equipment, and employee training to ensure we can continue to serve our customer's need for high-quality, assembled PCBs. Employee safety and the increasing sophistication of our customers’ electronic projects drive all our decisions and business strategies, and we will continue to improve processes and deliverables.

There are significant opportunities for growth in the Electronics Assembly industry, and especially the constantly evolving prototype/ New Product Introduction (NPI) market. I expect that in 2021, companies most committed to overall excellence, like Advanced Assembly, will experience hard-won success.
Roberto Yebra
Technology and Marketing Specialist, Test Research, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling