Simon Payne, CEO, XJTAG

The outlook for 2021 is very different than what was foreseen a year ago, at the start of 2020. The injection of a global pandemic on top of pre-existing geo-political tensions has dramatically altered the landscape for humanity.

Social distancing, quarantine, work from home, digital health monitoring have all created an even greater reliance on and demand for advanced electronics solutions. AI, High Performance Computing, Antenna in Package 5G, Vehicle electrification are all growing at even faster rates than predicted a year ago due to our new ways of living.

On the technology front, semiconductor advanced packaging concepts are coalescing around heterogeneous integration solutions. Die to die integration via either silicon interposers, chiplets, fan-out technology or a combination of these are proliferating. This silicon roadmap continues to drive the need for high throughout, flexible, extremely accurate assembly solutions, with capability to support placement over large panel formats.

Universal is committed to continued investment in the solutions that enable these roadmaps. We look forward to partnering with Industry leaders to realize their vision. We believe in the premise that advances in our technology industry bring about a better life for all.