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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 22, 2021

Mike Gunderson, President, MaRC Technologies, Inc./ MaRCTech2, Inc.

Certainly, we had no idea as we authored last year's Viewpoint projections that 2020 would bring a dramatic shift in the form of a global pandemic! However, for BTU, thanks to the dedication of our global team, it did not materially change our business. We even achieved record sales for our PYRAMAX™ reflow ovens sold into advanced packaging applications, in large part due to the success of the PYRAMAX TRUEFLAT configuration.

Both the TRUEFLAT and the award-winning PYRAMAX-Vacuum demonstrate how we have used our technology to solve customer problems such as substrate warpage and solder voiding.

In 2021, we will continue to focus on maximizing product yield and productivity while lowering Cost of Ownership. Our development pipeline is full -- and we look forward to rolling out new products large and small.

Building off our success and strongly supported by our parent company, Amtech Systems, we are committed to achieve growth in 2021 through focused product development in high growth areas of our industry.

Market forecasts for end markets including electric vehicles and others bode well for strong years ahead for our customers -- we look forward to further enabling their success.
Mike Gunderson
President, MaRC Technologies, Inc./ MaRCTech2, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling