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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 23, 2021

Reid Henry, President, Hentec Industries/RPS Automation

Despite the industry slowdown caused by the global COVID-19 pandemic, our experienced team of consultants continues to assist companies of all sizes enhance their electronics assembly processes-both on-site and "remotely".

We continue to provide problem resolution and risk assessment/management to help our clients avoid and mitigate problems. Observing "social distancing" has not hampered our effectiveness when we have been able to go on-site this past year.

ITM's highly acclaimed Process Audits continue to deliver positive, objective, and effective recommendations on how to "do it right" to improve electronics assembly operations. ITM Consulting is well known for some of the highest-rated seminars and webinars in the industry.

Our on-site and on-line workshops on such topics as "SMT Best Practices" as well as our "SMT Boot Camp" have prevailed in popularity as well as those covering SMT assembly, DFM, reflow, wave and selective soldering, as well as numerous other topics.
Reid Henry
President, Hentec Industries/RPS Automation
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling