circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 4, 2022

Leo Peng, CEO, 1 Click SMT

Despite challenges from supply chain issues, inflation, and slow recovery from the pandemic, we showed strong growth in 2021 with high demand for our electronic assembly equipment. We expect these challenges to continue well into 2022 but forecast continued growth with innovative developments in our equipment offering.

MPM is developing the Edison II ACT™ (Automatic Changeover Technology). This innovative printer technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation.

Camalot is introducing an Advanced Tilt and Rotate dispensing solution. This innovative design reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls underneath or around tall components.

Electrovert will be launching a new Auto-Adjust Exit Wing for wave soldering machines. It automatically adjusts to achieve proper wave flow characteristics to avoid bridging and solder splashing.

Vitronics Soltec now offers the Centurion™ Reflow Oven with True N2 to Air Switching. This is an option no one else offers that allows automatic switching between true air environment and true nitrogen environment.

ITW EAE has also made advancements on interface solutions for Industry 4.0/MES. These developments will lead to improvements in yield, data collection and overall equipment effectiveness.
Leo Peng
CEO, 1 Click SMT
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling