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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 6, 2022

Ed Zamborsky, Regional Sales Manager, Thermaltronics USA, Inc.

As 2021 is rapidly coming to an end we can't help wondering what 2022 will bring. 2020 and 2021 have been the most bizarre and challenging years in our 17-year history. 2020 was the year of the pandemic, company shut downs, layoffs and weak to no demand. 2021 has been the year of massive supply chain issues that will continue well into next year most industry experts say.

Customer demand came back with a vengeance in 2021, we have the largest backlog of orders in our history. Now, sourcing all of the electronic components will continue to challenge our ability to fill all of the orders in a timely manner.

The other challenge we face is hiring enough qualified employees to complement our current work force. We are located in Austin, Texas, which is experiencing unprecedented growth where unemployment is around 3%.

In spite of the challenges we face going forward, we are very optimistic about 2022 and beyond. We will continue to work hard to overcome all of the obstacles we face to get the job done and support our customers.
Ed Zamborsky
Regional Sales Manager, Thermaltronics USA, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling