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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 18, 2022

Ross Berntson, President & COO, Indium Corporation

For CircuitByte the year 2021 was very special in all respects. The previous year has shown, how important reliable co-operations with our partners are. Furthermore, the current worldwide pandemic and the problems involved in the procurement of components have shown the importance that digitalization takes.

Pursuant to the requirements on behalf of our customers we provided our BOM Connector with the Update 10 with extensive enhancements. Therefore, the tool can function as an important milestone for digitalization as well as a fundament for the Supply Chain 4.0 in the market.

For 2022 we expect no major changes of the pandemic situation. Therefore, companies will continue to face challenges like the current lack of components. Coincidently the digitalization allows forward planning of components. The cost of the components is not at the forefront. It is rather a question of where and when they are available. In addition, the focus will be on obsolescent management. The AI-based BOM Connector developed by us will ensure a consistent supply chain 4.0.
Ross Berntson
President & COO, Indium Corporation
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling