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BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 26, 2022

Edward Hughes, Chairman & CEO, Aculon, Inc.

While the Covid 19 pandemic continued to dominate 2021, I am pleased to report that Essegi Automation experienced dynamic growth, shipping a record number of Automated Component Storage Systems during the year.

An exciting trend during the past year was a marked increase in the sales and deliveries of integrated factory automation projects. These are installations with Incoming Materials Management, Automated Storage Towers and integrated AIV's (automated intelligent vehicles) which transport the components automatically from the Storage towers to the production lines. The fact that Essegi systems can integrate with ALL brands of pick and place equipment means this exciting technology is available to any electronics manufacturing company.

A clear trend during 2021, and continuing into 2022, is the use of automation to reduce labor costs. The pandemic has resulted in labor shortages, and a sizable increase in wages. The fact that the Essegi Storage Systems are able to pull kits without an operator present, and now with AIV's deliver them to the production area automatically, results in a substantial and immediate labor savings. During 2021, many customers reached an ROI of less than 12 months, based on the labor savings alone.

As we enter 2022, Essegi Automation is forecasting continued strong growth in markets around the world. Here in the Americas, the year begins with a record backlog of orders and strong project activity. While there are still challenges such as logistics and freight scheduling and costs, Essegi Automation looks forward to a great 2022.
Edward Hughes
Chairman & CEO, Aculon, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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Affordable Profiling