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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 27, 2022

Pierre Marechal, Managing Director, Essemtec USA

Despite all the COVID circumstances INGUN USA looks back to another record year in 2021. Although the supply shortages in the electronics industry slowed down the growth, we notice that the EV sector is adding some more pace which most likely will fuel some growth peaks in coming years before it will flatten out.

Besides the EV sector also the 5G world is advancing and will add to further growth.

It will be very interesting how the US manufacturing landscape will change because of the component shortages due to the dependency on China and Asia.

In 2022, INGUN USA will try to be present at several trade shows if they are held in the "old-fashion" way.

With our clear vision and focus on "Partner for future technology", we are prepared to serve our customers with the highest quality in test solutions, first class customer service, and therefore looking forward to the next record year in 2022.
Pierre Marechal
Managing Director, Essemtec USA
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling