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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 27, 2022

Mathew Stevenson, VP of Sales and Marketing, Sunstone Circuits®

2022 will continue to face multiple challenges: labor and components shortages from the pandemic as well as the market trends towards smaller lot sizes and shorter times to market.

To cope with what's ahead, the industry needs a kind of flexible scalability. Industry 4.0 integrations, promising advanced production that is digital from start to finish, are becoming serious realities to consider.

These same integrated solutions are also giving us new avenues towards more innovative electronic devices and with greater speed. This presents a prospect for onshoring of both prototyping and NPI that will reduce unwanted IP exposure.

The electronics assembly industry is evolving fast, going far beyond incremental improvements towards giant leaps in capability. The decision on how to adapt may come in the year to come

In November 2021, Essemtec merged with Nano Dimension, a pioneer in Additively Manufactured Electronics (AME). While Essemtec will continue to develop and deliver leading assembly solutions, the merger immediately generated powerful synergies.

The combined vision of additive plus assembly will materialize in 2022. I predict that this pairing will scale up the value proposition for advanced electronics prototyping and production onshore.

We are seeing the convergence of these powerful technologies together with AI into a unique solution not seen before. It's something we’ll all need to get ready for.
Mathew Stevenson
VP of Sales and Marketing, Sunstone Circuits®
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling