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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 3, 2022

Mike Douglas, General Manager, PRIDE Industries, Inc.

"Resilience is How We Embrace Adversity"

Scienscope was well on its way to a full recovery in sales and marketing. However, the sudden congestion of the domestic and international logistics hit hard and caused the backlog in the delivery. Scienscope was affected indirectly through our supply chain, caused by an IC shortage.

We believe the electronics assembly industry will continue to grow this year. But the focus on automation through innovation will prevail. That is why Scienscope is expanding its production. Scienscope has added a 15,000 Sq of production floor in 2021 to meet the increasing demand for its component counters, incoming barcode scanners, and smart racks. The unencumbered space allows Scienscope to increase its production capacity and shorten the delivery time.

Scienscope strives to promptly deliver automatic component counting and storing equipment to ease our customer's pressure on the workforce shortage while increasing productivity with real-time inventory updates. Global SMT manufacturers can count on the Scienscope team to seamlessly integrate the component management equipment to their MES, ERP, or Oracle, with a return on investment in less than a year.

We look forward to visiting our customers and attending shows as there are many new and exciting technologies this year to see. Nothing beats being there, being able to touch it and feel it.
Mike Douglas
General Manager, PRIDE Industries, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling