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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 8, 2022

Alex Geiger, Sales Account Manager, YXLON

When we look back on 2021 we certainly won't remember it as an easy year- although the one thing we can't complain about is business. It's been a challenge this year to keep up with customer demand.

In 2021 we've seen our industry come to the forefront of current events, with component shortages keeping new cars out of our garages everywhere. In response to this demand, we've upgraded our factory in Shanghai to a significantly larger space that will allow us not only greater capacity but more efficient production flow — enabling shorter customer lead times.

Our US factory has become even more flexible — building our custom high temperature belt furnaces and now BDF semiconductor diffusion furnaces. We've also been leveraging our capabilities in the US to assemble and test Pyramax reflow ovens for customers in certain sensitive industries such as military and aerospace. While we expect many of the challenges of 2021 to continue for some time, we also see the foundation of growth extending well into the future, making us very optimistic for 2022.
Alex Geiger
Sales Account Manager, YXLON International
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling