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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 13, 2023

Tom Lomsdalen, CEO, Virinco

In 2022, X2F continued to unlock unprecedented manufacturing capabilities in performance polymers with their ground-breaking molding technology. High-viscosity, difficult-to-mold materials are no match for X2F's technique, which is production ready for high-volume capacities.

Additionally, the X2F process offers ground-breaking advantages for green manufacturing by using 50–90% less energy, and in their recent collaboration with Convestro, X2F launched a thermally conductive polycarbonate heat-sink that was 49% lighter and less expensive than traditional cast aluminum versions for automotive applications.

Throughout the year, X2F was successful in securing a number of strategic connections, including partnering with Krayden, a top distributor with expertise in adhesives, sealants, solder, coatings, specialty chemicals, and solvents.

The team has already received additional projects from several of their eager customers, and X2F anticipates a very busy 2023. Although supply chain shortages continued to negatively affect many in the industry, X2F was able to leverage their North American manufacturing as a positive for many customers looking to onshore their production.

Visit X2F at APEX 2023 and other industry conferences to learn more about the technical milestones they have achieved, and how the benefits of their breakthrough manufacturing process will alter the industry.
Tom Lomsdalen
CEO, Virinco
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling