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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 18, 2023

Ray Bellavance, Vice President of Global Sales and Marketing, MicroCare

Here at Nordson Electronics Solutions, business in the printed circuit board segment has been steady — even slow at times — in the last two years. As with the rest of the industry, component shortages and the automotive-sector slowdown produced bumps. But we foresee a pick-up in the market and fewer supply chain disruptions as we move into 2023.

At Nordson, we spent the last 2 years making our manufacturing operations as efficient as possible to support customers who face similar unpredictable circumstances. We are also focused to bring new products to support our key EMS customers and serve the automotive sector.

We are very excited about the new selective soldering product — SELECT Synchro. Just released, it is a revolutionary approach that delivers 30% higher throughput in footprint that is 60% reduced. The Synchro is a strong alternate to wave soldering with much higher flexibility, especially for low-temperature soldering requirements.

In the dispensing and conformal coating arenas, more new systems and solutions in the coming year will enable our customers to reach the throughout and precision that the market demands in printed circuit board assembly.

There are still headwinds and some market uncertainty, but we know that our global team will rise to the occasion.
Ray Bellavance
Vice President of Global Sales and Marketing, MicroCare
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling