circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 1, 2023

Marco Sánchez National Business Manager Mexico, SMT Thermal Discoveries

Despite the numerous industry pressures over the past year, ECD experienced solid growth in 2022 and we anticipate 2023 being equally — if not more — successful. Among many highlights, demand for OvenSENTINEL™ continuous monitoring saw a sharp increase over the last 18 months, as electronics manufacturers seek to ensure greater traceability and reliability of increasingly complex assemblies.

Compared to the first half of 2022, supply chain challenges seem to have eased and inflation is stabilizing. Unfortunately, one underlying cause of the supply chain improvements is diminished demand in some sectors.

Large capital expenditures will come under greater scrutiny (versus the digital boom of the pandemic era). Still, we are confident that ECD's affordable, value-creating technologies will help electronics manufacturers protect margins, even as markets re-set to current economic realities.

In January, at IPC APEX Expo, ECD will debut an evolutionary product for thermal profiling that upends conventional designs and offers improved productivity and data access.

In keeping with our philosophy of practical, cost-effective tools, the portfolio addition provides seamless integration with ECD's scalable soldering machine quality management pallets. Process control, operational efficiency, and ease of use are at the foundation of all ECD products — including this latest launch — as we strive to help manufacturers realize higher throughput and yields.
Marco Sánchez
National Business Manager Mexico, SMT Thermal Discoveries
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling