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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2023

Christopher Morath, Chief Operating Officer, Heller Industries, Inc.

2022 was interesting time for us, opened up many opportunities. Nevertheless, this business opportunities continue to grow and with them the challenges we face regarding the availability of materials in 2022 will continue in 2023.

Challenges on which we focus to meet the needs of our customers through our alliances strategic.

Our business in Mexico is growing and our solution for the reduction of Voids (reflow with Vacuum System) is very well received by our customers. Without a doubt, innovation and our service make the difference.

We know that next 2023 come with new challenges and more opportunities for all.
Christopher Morath
Chief Operating Officer, Heller Industries, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling