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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 10, 2023

Mr Shigeo Wada, Managing Director, DEN-ON INSTRUMENTS JAPAN

DDM Novastar recently celebrated its 40-year anniversary as a leading USA-based manufacturer of surface mount and through-hole assembly systems, a landmark milestone indeed! We are truly proud of this achievement and thank all our employees for their dedication and hard work.

As importantly, we thank our many loyal customers over all these years as well as our continually evolving new customers who work with us to upgrade their printed circuit board assembly processes.

With heightened reshoring emphasis on "Made in the USA" products, 2022 was a strong year overall and DDM Novastar is well positioned for future growth. Surface mount assembly systems continue to be our main emphasis but, of particular note, there has been an increased need for wave soldering systems...through-hole soldering is alive and well!

As we look forward to 2023, travel continues to open up and we will be hosting a full slate of quarterly technical workshops focusing on implementation of low volume surface mount assembly processes at our Pennsylvania-based manufacturing location.

Although there are potential economic headwinds being forecast for 2023, we are optimistic that manufacturing will only continue to grow here in the United States and manufacturers will continue to partner with long-standing USA-based companies like DDM Novastar to further increase efficiencies in their manufacturing processes.
Mr Shigeo Wada
Managing Director, DEN-ON INSTRUMENTS JAPAN
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling