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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 21, 2023

Bob LePage, Marketing Manager, Circuit Technology Center

Exercising agility in an unpredictable future
For Cogiscan in 2023, thriving is about agility. Remaining close to our colleagues, customers, and partners to understand their evolving needs and ensure our offering solves real manufacturing problems. Through our participation in the Dürr Digital Factory and partnership with iTAC Software AG, we plan to incorporate new technologies that will better enable our customers to quickly realize meaningful improvements in their factory digitalization goals.

Technology
AI and machine-learning systems are being embraced in specific SMT use-cases to solve every day manufacturing challenges and I only expect this adoption to increase. Our AI-powered analytics solution is helping manufacturers dramatically reduce their false call rate at AOI – a problem that continues to plague many PCBA manufacturers to bleed time and efficiency on the line.

Near-Shoring
Tune into any news outlet, and you'll hear about the importance of "near-shoring" – it's clear that to remain agile, we can no longer sole source production to a specific region. As we increase our share of manufacturing and assembly in the Americas, manufacturers will need to fully embrace automation and digitalization.

As these investments become a reality and manufacturers look to bring the factory of the future to today, they will need partners like Cogiscan to achieve their factory digitalization goals.

I can't wait to see what we'll reach together.
Bob LePage
Marketing Manager, Circuit Technology Center
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling