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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 23, 2023

Wayne Eng, Global Head of Market Strategy, Henkel Adhesive Technologies

2022 was a challenging year for the electronics manufacturing industry due to supply chain shortages and increased demand, especially in the automotive and IoT sectors. 2023 will continue to experience geopolitical uncertainty and the impact of globalization, leading to a reassessment of manufacturing footprints and potential shifts towards countries such as Vietnam, Mexico, and India.

TRI has a vast selection of new products ready for 2023. New configurations, optical upgrades, and mechanical improvements are on the horizon. Our flagship 3D AOI TR7700Q SII will broaden its spectrum with enhanced configurations and improved inspection speed.

The 3D AXI TR7600 Series will also have a 110v X-ray source option for both TDI and Flat Panel solutions for advanced packaging and semiconductor applications. More upgrades will come for our X-ray product line, specifically for automotive industry applications.

TRI has been improving AI solutions; we have come very far from smart programming to autonomous AI programming, AI algorithms, and AI repair stations. With continuous and arduous work from our engineers, TRI improved the reliability of the AI Models. I am very proud of our AI solutions' vast number of possible applications.
Wayne Eng
Global Head of Market Strategy, Industrials — Data & Telecom business Unit, Henkel Adhesive Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling