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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 10, 2024

Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics

In 2023, the electronics manufacturing landscape experiences a transformative shift as industry leaders strategically relocate operations from China to emerging markets due to escalating labor costs and trade tensions. TRI proactively expanded into Vietnam and Thailand, aligning perfectly with this trend.

The SMT industry is set to thrive in 2024, driven by increased demand for high-mix, low-volume production, the adoption of AI and Industry 4.0 technologies, and a heightened focus on sustainability.

In recent years, TRI has embraced AI-powered solutions, integrating them into inspection algorithms and repair stations to reduce manual inspections. Industry leaders currently utilize these AI applications to detect defects in SMT, Semiconductor, and Advanced Packaging industries.

AI and deep learning technologies play a pivotal role in overcoming challenges posed by the complexity and diversity of PCBs and components. The trend toward miniaturization, encompassing higher-density designs and smaller components, presents challenges for automated optical inspections.

Traditional rule-based algorithms struggle with the reliable inspection of tiny contact pads, minor defects, and concealed solder points. AI empowers inspection equipment to overcome these limitations, ensuring reliable checks on various devices and materials.

With a positive outlook, SMT manufacturers, including our major customers, are strategically adapting to these shifts, positioning themselves for success not only in 2024 but also in the evolving landscape beyond.
Mike Dube
Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling