Mark Kannenberg, CEO, North American Electronics Division, RBP Chemical Technology

Rochester Electronics continues to experience consistent year-over-year growth in new semiconductor products and engineering services, driven by innovative manufacturing capabilities. Rochester's industry-unique capabilities enable us to provide full onshore USA turnkey solutions, which encompasses product design, assembly, packaging, and testing across diverse markets, including automotive, industrial, medical, and military applications.

Our integrated approach offers customers demand-based production options, providing supply chain flexibility to mitigate risks and avoid both overestimation and underestimation of production inventory.

In 2024, Rochester will be broadening our manufacturing services to cater to diverse customer requirements, encompassing wafer die processing, package assembly, testing, component lead finishing, reliability testing, and failure analysis.

Rochester collaborates with universities and high schools to create continuous feeder programs, insuring future careers for new engineers, technicians, and skilled operators. This initiative aims to boost onshore manufacturing capabilities, backed by substantial investments in new facilities, semiconductor equipment, production systems, and employee training.