circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 31, 2024

Todd Rountree, President & COO, Austin American Technology

2023 was another great year for Viscom, Inc. The market share increased for our SMT product line as well as our newest introduction of AOI and AXI products addressing the emerging EV markets.

We will be demonstrating a new line of AOI equipment at APEX Exhibition on April 9 -11, 2024 at the Anaheim Convention Center. A highlight of the new generation of the model S6059 will be the double-sided 3D AOI inspection system.

The new system is equipped with two sensor heads that capture images and 3D height information on top and bottom side at high speed in 2D,2.5D and 3D resulting in maximum defect detection and high throughput.

Also, at APEX we will be demonstrating the latest offering of the award winning AXI iX7059 which includes an innovative, effective CT-based 3D image acquisition concept for reliable detection of soldering defects such as head-in pillow, voiding in BGA and LGA components, as well as fill levels of THT solder joints.

The ability to handle sample PCBs up to 1600mm (64.72") in length and weights up to 40KG (88lbs) make it adaptable to many applications. We look forward to seeing everyone at APEX in April.
Todd Rountree
President & COO, Austin American Technology
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling