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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 5, 2024

Bree Oldham, President and CEO, Electronic Design & Manufacturing

Despite slowdowns in business during 2023, Heller managed to gain traction in the market, in part due to new technology buys at Tier 1 customers for automotive and power electronics applications.

Winning products included our new High-UPH (units per hour) Vacuum and Formic Reflow ovens that deliver high yields and low void rates at industry-leading cost of ownership.

For 2024, barring macroeconomic disruptions Heller anticipates a rebound in both the SMT and Semicon segments by mid-year as supply chain inventories normalize and our customers' line utilizations improve.

We are seeing increased customer requests for custom curing and sintering solutions driven by production ramps of SiC technology for automotive and power electronics. As for advanced packaging, we expect acceleration in the second half.

Regionally, Heller has been experiencing strong demand growth in North America, Europe and India as major EMS and automotive customers diversify their supply chains and investments are spurred by government incentives such as the US CHIPS Act.

In 2024, Heller will continue to position itself to capitalize on these trends through collaborations with key customers and targeted investments in local service and engineering, demo equipment and production facilities.
Bree Oldham
President and CEO, Electronic Design & Manufacturing
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling