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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 12, 2024

Ryan Scheck, Product Specialist, Bowman XRF

Will you be launching new products or services in 2024?
Our Elpejet® solder resist IJ 2467 for digital coating is now ready for the market and will delight the first customers in 2024. This "ink" meets all the criteria of the IPC-SM-840E standard, and that's saying something.

Elpejet® legend links in white or yellow can be supplied at the same time. This marks the launch of a completely new coating generation – interest is huge!

Have supply chain shortages caused problems, if so what has your team done to reduce issues for 2024?
Various chemical raw materials have long been "threatened with extinction" or have already been taken off the market due to REACH or new regulations, and we have learned to deal with this.
Ryan Scheck
Product Specialist, Bowman XRF
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling