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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 15, 2024

Mohammad Ahmad, CEO, Z2Data

AIM Solder celebrates a resilient performance in the face of economic challenges, achieving positive results through strategic growth and supply chain resolutions. With almost a century of experience, AIM remains competitive and profitable by strategically navigating volatile commodity metals prices and rising interest rates.

AIM's success is driven by innovation, particularly in miniaturization and product reliability. Recent advancements include our new halogen-free NC259FPA solder pastes for Type 6 and Type 7 applications. In the coming year, AIM plans to release high-reliability and low-temperature offerings, in addition to a user-friendly website for easier access to product information.

Having worked at AIM for over 25 years, I've observed the company's commitment to a remarkable workplace environment, evidenced by employee retention and a diverse, experienced workforce. Notably, AIM's R&D staff, boasting multiple doctorates from seven nations, underscores the company's commitment to recognizing and cultivating talent.

2024 marks a pivotal year for AIM's growth.

We have more than ten manufacturing sites globally and are looking to expand further into the Asia marketplace. Notable hires and promotions in 2023 are expected to drive domestic and international business success, solidifying AIM's dynamic presence in the industry.
Mohammad Ahmad
CEO, Z2Data
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling