circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 22, 2024

Kaitlyn Dotson, COO, CalcuQuote

Though 2023 has had its challenges — economic, geopolitical, and otherwise! — ECD made it the year of investment. Leveraging our outstanding results and the growth realized during 2021 and 2022, ECD reinvested our earnings into expanded R&D and product development initiatives.

We doubled the size of our engineering team, added resources for software innovation, and digitized many operational tools. Over the past twelve months, the outcomes of these efforts have been demonstrated.

In January, we introduced the market’s first-ever touchscreen thermal profiler, the M.O.L.E. EV6. The rollout of that product ranks among ECD's most successful, both in terms of industry adoption and the seamlessness of the transition to the new platform.

M.O.L.E. EV6's intuitive control and touchscreen display have simplified everything for operators and eliminated the need to download data to a PC for analysis. It's been a game-changer. In the same vein, we ended the year by introducing a 20-channel thermal profiler, also on the EV touchscreen technology platform. The M.O.L.E. EV20's high channel count is designed for complex assemblies requiring numerous thermal measurements.

In terms of the market, there are bright spots. Supply chain pressures have eased over the last six months, we have seen some beneficial manufacturing geography shifts, and it appears that following 2024’s projected tempered growth, 2025 will be another solid year. As for ECD, we are not pulling back.

The EV-generation thermal profiler portfolio will continue its expansion to address dynamic requirements. In addition, we are adding new feature sets and enhancing all our product lines through high-performance software solutions.
Kaitlyn Dotson
COO, CalcuQuote
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling