Simon Malandain, Commercial Director, Protavic International

As Moisture Sensitive Devices (MSD) boards continue to get smaller, thinner, hold more components, have more layers and increase capacity of data throughput into 2024, and extreme weather patterns supply chain delays continue, the subject Electrochemical Failure will receive more attention from quality and reliability engineers.

Many of these engineers will have to revisit IPC 9201A and JEDEC STD 033 to take a hard look at the humidity equation and ask themselves, "How Can I Mitigate The Moisture Problems."

Engineers who chase down moisture problems, not only takes up their valuable time but can cause major delays in production as well. Topics such as Baking, Humidity Indicator Cards, Thermal Cycling, Dry Time, Delamination Inspection will be keeping them busy.

From my viewpoint, quality and reliability engineers will be spending time in 2024 tackling the following:

1. What are some best practices to Keep MSDs dry during shipping and handling to prevent moisture damage?

2. How can I reduce labor associated with inspecting MSDs for moisture excursions during long term storage...both in controlled and uncontrolled environments?

3. What are some options for moisture indicators to determine if a moisture event has occurred. Is the traditional HIC card the only option? Or are there alternatives?

Management will be tackling the following:

4. How can I help my employees determine when to change out a desiccant bag upon saturation?

5. How can I retard condensation in my Moisture Barrier Bags during shipping and handling?

6. How Can I Reduce Baking prior to reflow operations?