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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2025

Eliud Herrera, Business Unit Manager, Selectronic Assembly

The need and demand in electronics manufacturing in the area of soldering-/reflow technology appears to be unbroken - even if demand is declining slightly again after a significant increase.

It is clearly noticeable that the importance of power electronics, the semiconductor sector and the topic of advanced packaging in general is constantly increasing. Adapting optimally to these exciting changes is our global focus for 2025 and we are pleased to be able to offer our customers and partners corresponding solutions in a very timely manner.

The fact that energy efficiency and sustainability are becoming increasingly important is very convenient for us. SMT Thermal Discoveries has traditionally focused on taking a pioneering role in these areas in particular - with great success.

Energy-efficient, long-lasting and low-maintenance solutions will be the key in many areas in the future. We believe we are well positioned and prepared for this with our sales and service partners all over Europe and the branches in China and Mexico.
Eliud Herrera
Business Unit Manager, Selectronic Assembly
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling