Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

January 22, 2025

Mark Waterman, Electronics Division Manager, ECD

As we close out another successful year, we reflect on the tremendous growth and innovation we and our customers have achieved.

Our commitment to reliable and innovative plasma systems shows in all of the projects we work on. We continue to place a strong emphasis on customer success; ensuring our clients receive the full benefits of their plasma cleaning systems through education and service.

As we look ahead to 2025, we look forward to pushing boundaries in the bonding and PCB etching markets, while enabling customers to advance their projects and initiatives.

Trade Shows

We hope to see everyone at a show this year. We'll be exhibiting at Semicon West October 7-9 in Phoenix, AZ; and CamX, April 8-11 in Orlando, FL. At each show will be demonstrating our best-selling Plasma Wand entry-level atmospheric system.

We would like to thank our customers for another great year and look forward to 2025!

Mark Waterman
Electronics Division Manager, ECD

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura