circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 23, 2025

Mark Kanpurwala, VP Sales & Marketing, Aven

It's been a mixed bag for the electronics industry over the last year, with sectors such as electric vehicles struggling while others like data center systems experiencing a steady growth trajectory. Manufacturing investments are undoubtedly coming under more scrutiny to demonstrate production environment value. Approval of capital expenditures demands that technologies are proven to save time, improve quality, and lower costs.

Fortunately, that's the value proposition of ECD’s entire product portfolio, especially with the latest touchscreen M.O.L.E. EV thermal profilers. The need for robust thermal profiling and component storage technologies spans manufacturing operations of all sizes. Even so-called ‘smaller’ shops are tasked with building increasingly complex assemblies that dictate exceptional process control.

ECD's technology roadmap progress continued unabated throughout 2024, and we have focused on developing new hardware and software products poised for release in 2025. Customers will benefit from intuitive profile development software and expanded hardware accessories that bridge all soldering equipment requirements, delivering affordability and excellence.

As for market conditions in 2025, the first quarter may begin slowly, but we believe the year will be positive overall. While IPC has predicted about 5% growth in electronics manufacturing worldwide, ECD is slightly more optimistic than that, especially in specific regions as production shifts from conventional strongholds to more diverse geographies in Asia and North America and we are tailoring our offerings to meet those expectations.
Mark Kanpurwala
VP Sales & Marketing, Aven
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling