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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 30, 2025

Mark McMeen, VP, Engineering Services/Manufacturing, STI Electronics, Inc.

2024 has been an interesting year for Solderstar, with continued growth despite challenges in the European automotive sector. Slower-than-anticipated adoption of EV technologies in markets like Germany and Eastern Europe has created uncertainties. However, these conditions have encouraged manufacturers to scrutinize their equipment purchases more closely, looking for solutions that deliver both cost savings and production efficiency—a focus where Solderstar excels.

Our Reflow Shuttle Verification Tool enables customers to manage reflow oven maintenance proactively. By monitoring parameters such as vibration in three axes, conveyor speed, nitrogen levels, vacuum, and temperature profiles, the tool helps identify process changes early. The addition of oxygen monitoring in parts per million (PPM) allows manufacturers to track nitrogen usage more precisely and ensure it is applied efficiently. This supports both reflow performance and environmental goals.

In 2025, we expect automotive production to rebound, and Tier 1 EMS providers will increasingly prioritize environmental performance over cost savings. As nitrogen usage continues to be a major focus, Solderstar's tools will help manufacturers optimize nitrogen application, reduce wastage, and support ISO 14001 compliance—ensuring both quality and sustainability in PCB production.
Mark McMeen
VP, Engineering Services/Manufacturing, STI Electronics, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling