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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 3, 2025

Tim Filteau, Chief Operating Officer, Naprotek

2024: A Year of Backend, THT Assembly, and Component Management Automation

The rise in post-SMT automation has been building since Brexit and the COVID-19 pandemic, and 2024 saw further acceleration. Socio-economic pressures, including inflation-driven pay rises and competition for available operators, have intensified the challenges of heavily manual processes. Manufacturers are increasingly adopting automation solutions to address inefficiencies in THT assembly and backend electronics production.

The ongoing challenges of securing skilled labor and managing rising operational costs have further fueled the shift towards automation. As a result, suppliers in these areas have experienced exceptional growth in the UK and Ireland, reaching record highs. For example, Promotion USA has delivered advanced robotic soldering solutions, PVA continues to lead in dispensing and conformal coating technology, Scienscope provides innovative component management and X-ray systems, and Kolb specializes in cleaning PCBAs, stencils, and tooling.

Looking ahead to 2025, we anticipate continued investment in automating peripheral processes that create production bottlenecks. Additionally, the establishment of new production facilities across the UK and Ireland is expected, driven by stable economic conditions and strengthened ties with the U.S.A. These developments position the region for growth in electronics manufacturing.

At Altus, we are uniquely positioned to support this evolution by offering complete solutions for outfitting electronic production facilities. With our comprehensive portfolio, we are ready to act as a turn-key provider for manufacturers navigating the next wave of automation.
Tim Filteau
Chief Operating Officer, Naprotek
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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