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BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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ECD
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If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 5, 2025

John VanNewkirk, CEO, CheckSum

We look towards 2025 very favorably. This is based on the fact that most, but not all, supply chain issues have been resolved and normalcy has returned to the electronics components marketplace.

We are continuously looking at ways to improve upon what we do here at JEMS, and utilizing AI tools especially within our procurement and supply chain is now under investigation to understand what is available and how best it could work with what we have already set up.

We will be launching some new programs with both existing and new customers in 2025, one of which is in clean energy. We are excited to work with our first customer in this sector and are looking forward to starting that project in Q1, which is projected to be about a $12 million/year account. Based on our AS9100 and ITAR, we are seeing growing demand within the Mil/AS sector for our services.

Our ability to build very complex products that can meet the extreme demands of shock, vibration and acceleration often experienced in space applications (launch vehicles, LEO and MEO satellites) draws these new opportunities to us. The need, in some cases, for radiation hardened PCBAs is something that wouldn't have crossed my mind five years ago but now is a reality.

Currently, we are working on a half dozen such new projects and opportunities and would expect a few more new and still unknown to surface in 2025. The fact that our sister customer, JAVAD GNSS, is an industry leader in highly dynamic PNT (Position, Navigation and Timing) solutions allows both companies to leverage each other's expertise when pursuing new customers. Knowing that we build to that high standard, commercial customers benefit from that as well, so those opportunities are available to us too. So, yes, I look towards 2025 with great optimism.
John VanNewkirk
CEO, CheckSum
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling